State of the art Infrastructure in Bangalore, India

We are a business house with class 5000 clean environment, screen printing, profiling die attach, plasma cleaning, wire bonding of 0.35 micron pitch, molding / dicing with BGA /QFN technology, lazer trimming and wave soldering. To meet defense and aerospace applications, we are equipped with high resolution testing and calibration devices for R&D work and most modern furnaces / ovens/ vacuums and humidity chambers to produce MIL standard components. Our world class design and manufacturing facilities include:

SMT ASSEMBLY PLANT

  • Screen Printer
  • Solder Reflow
  • Pick and place
  • Router
  • AOI
  • High Resolution X-Ray Inspection

ELECTRICITY & RELIABILITY TEST

  • Network and Spectrum Analyser
  • Function Generators
  • Oscilloscopes
  • Scanning Acoustic Microscope
  • Wire Pull / Die Shear Tester
  • High Magnification Microscope

IC PACKAGING & HMC CAPABILITY

  • Die Attach
  • Molding
  • Dicing
  • FlipChip
  • Wire bonding
  • Screen Printing
  • Lazer Trimmer

CLASS 5000 CLEAN ENVIRONMENT

  • 24 / 7 Operation with utility backup
  • MIL Standard temperature and humidity control