We are a business house with class 5000 clean environment, screen printing, profiling die attach, plasma cleaning, wire bonding of 0.35 micron pitch, molding / dicing with BGA /QFN technology, lazer trimming and wave soldering. To meet defense and aerospace applications, we are equipped with high resolution testing and calibration devices for R&D work and most modern furnaces / ovens/ vacuums and humidity chambers to produce MIL standard components. Our world class design and manufacturing facilities include:
SMT ASSEMBLY PLANT
- Screen Printer
- Solder Reflow
- Pick and place
- Router
- AOI
- High Resolution X-Ray Inspection
ELECTRICITY & RELIABILITY TEST
- Network and Spectrum Analyser
- Function Generators
- Oscilloscopes
- Scanning Acoustic Microscope
- Wire Pull / Die Shear Tester
- High Magnification Microscope
IC PACKAGING & HMC CAPABILITY
- Die Attach
- Molding
- Dicing
- FlipChip
- Wire bonding
- Screen Printing
- Lazer Trimmer
CLASS 5000 CLEAN ENVIRONMENT
- 24 / 7 Operation with utility backup
- MIL Standard temperature and humidity control